XYCOM SXT1811T-A

1. Overview

2. Main Specifications

• Operating Voltage: 24 V DC (supports 18 V – 30 V input)
• Interfaces: RS-485, 10/100 Mbps Ethernet, XVME
• Processor: Intel Xeon series (customizable)
• Storage: Up to 64 GB HBM (High Bandwidth Memory)
• Dimensions: 150 mm × 100 mm × 50 mm
• Protection Rating: IP65
• Operating Temperature: -20 °C to 60 °C

3. Product Features

• Low Power Consumption & Efficient Heat Dissipation: The low-power chip design combined with passive heat dissipation reduces energy consumption and heat generation, extending the service life of the module.
• Modular Plug-and-Play Design: Supports hot-swapping, simplifying installation and maintenance processes and minimizing downtime.
• Multi-Interface Compatibility: Offers multiple communication methods including RS-485, Ethernet, and XVME, facilitating seamless system integration.
• High Reliability: Boasting an IP65 protection rating and wide operating temperature range, it can adapt to harsh industrial environments.

4. Structure and Components

• Main Control Board: Equipped with a customizable Intel Xeon processor.
• Storage Module: Supports up to 64 GB of HBM for high-speed data access.
• Communication Interface Card: Provides RS-485, Ethernet, and XVME interfaces for diversified connectivity.
• Heat Dissipation System: Features passive heat sinks and heat dissipation channels to ensure thermal stability.
• Power Module: Accepts 24 V DC input with wide voltage tolerance for stable power supply.

5. Application Fields

• Industrial automation control systems
• CNC (Computer Numerical Control) machine tool platforms
• Robotics and intelligent manufacturing
• On-site data acquisition and monitoring (SCADA) systems
• Other industrial scenarios requiring high-reliability embedded computing

6. Installation and Maintenance

• Rapid Deployment: The modular plug-and-play structure enables on-site plug-and-play for quick system setup.
• Hot-Swapping Replacement: Faulty modules can be replaced without powering off the system, reducing downtime losses.
• Heat Dissipation Inspection: Regularly check if the heat sinks are covered with dust and maintain good ventilation to ensure heat dissipation efficiency.
• Firmware Upgrade: Remote firmware updates can be performed via Ethernet or XVME interfaces to ensure system security and keep functions up-to-date.