XYCOM XVME-290
Overview
The XYCOM XVME‑290 is a VMEbus-compliant digital I/O module that delivers high-speed parallel input/output functionality with 32 independent channels, ideal for industrial automation, process control, and other related scenarios. Available in single-height single-width (1U) or double-height (2U) form factors, the module can be directly inserted into a standard VME‑PI backplane and is compatible with all mainstream VME systems.
Specifications
- Number of Channels: 32 channels
- Input Voltage Threshold: 0.8 V (max) / 2.0 V (min)
- Output Voltage/Current: 0.4 V → 12 mA (max), 2.4 V → -3 mA (min)
- Power Supply: +5 V, typical power consumption 1.3 A, maximum 1.5 A
- Dimensions: Single-height: 150 × 116.7 mm; Double-height: 160 × 233.4 mm
- Operating Temperature: 0 °C – 32 °C (operating); -40 °C – 85 °C (non-operating)
- Humidity: 5% – 95% RH (non-condensing)
- Altitude: 0 – 10,000 ft (operating); 0 – 50,000 ft (non-operating)
- Vibration/Shock Resistance: 5 – 2000 Hz with 0.015 in peak-to-peak displacement and 2.5 g peak acceleration; 30 g shock resistance (operating)
Product Features
- Fully complies with VMEbus physical and electrical specifications and supports hot-swapping.
- Adopts the 68230 parallel interface with two chips per module to achieve high-speed and reliable I/O interaction.
- Offers multiple jumper configurations (base address, address modifier, interrupt level, etc.) for flexible adaptation to different system requirements.
- Provides versatile connection methods: direct insertion into the P2 backplane or dual-channel layout via two sets of 50-pin connectors (JK1, JK2).
- Boasts strong environmental adaptability with IP65 protection, suitable for harsh industrial sites.
Structure and Components
- Power Module: Responsible for regulated +5 V power supply.
- Communication/Interface Board: Includes VME‑PI interface, JK1/JK2 connectors, and P2 backplane pins.
- Processor Chips (68230) × 2: Implements digital I/O functions.
- Heat Dissipation Device: Metal heat sink ensures stable operating temperature.
- Enclosure: Metal chassis provides mechanical strength and electromagnetic shielding.
Application Areas
- Industrial automation control systems
- Process control and monitoring
- Machine vision and robot I/O expansion
- Building automation and energy management
- Any VME environment requiring high-speed and reliable digital I/O
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